birth:

place:

B.S. Electrical Engineering, Texas A&M University, 1988; M.S. Electrical Engineering, University of Michigan at Ann Arbor, 1990

Ph.D. Electrical Engineering, University of Michigan at Ann Arbor, 1995

Assistant Professor of Electrical and Computer Engineering University of Minnesota

Rhonda Franklin Drayton

URL: http://www2.itdean.umn.edu/faculty/detail.jsp?facultyID=70 OR http://www.ece.umn.edu/faculty/drayton.html
email: drayton@ece.umn.edu

University of Minnesota faculty since 1998.

* Presidential Early Career Award for Scientists and Engineers

Specialties

* circuits
* fields and photonics
* microelectromechanical systems (MEMS)
* wireless communications

Research interests

My research interests focus on exploring the use of silicon micromachining (MEMs) in radio frequency (rf) and microwave applications related to wireless, mobile and satellite communication systems. In particular, emphasis is directed toward novel design, fabrication, and testing methods of planar circuits and antennas, such as microstrip, as well as package technology for integrated circuits. I am also interested in exploring the use of advanced micromachined packages and interconnects in photonic and high speed electronic (also referred to as rf/microwave photonic) applications.

My educational interests focus on offering a diverse learning experience to future rf and microwave engineers through traditional classroom training, practical CAD design, hands-on laboratory experiences and research opportunities. Web-based learning methods and multidisciplinary approaches are also explored that offer broader training and understanding of how applied electromagnetics fundamentals relate to applications in the communications field.

Recent publications

  1. Micromachined patch antenna, IEEE Transactions on Antennas and Propagation, 1998 (with I. Papapolymerou, L. P. B. Katehi)
  2. Monolithic packaging concepts for high isolation in circuits and antennas, IEEE Transactions on Microwave Theory and Techniques, 1998 (with R. M. Henderson, L. P. B. Katehi)
  3. High frequency circuit components on micromachined variable thickness substrates, IEE Electronics Letters, 1997 (with R. M. Henderson, L. P. B. Katehi)
  4. Development of self-packaged high frequency circuits using micromachining techniques, ISHM International Journal Microcircuits and Electronic Packaging, Third Quarter, 1995 (with T. M. Weller, L. P. B. Katehi)
  5. Development of self-packaged high frequency circuits using micromachining techniques, IEEE Transactions on Microwave Theory and Techniques, 1995 (with L. P. B. Katehi)

Computer Scientists of the African Diaspora

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State University of New York at Buffalo

visitors since opening 5/25/97

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